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TI, Microsoft to Speed IoT Development

Hardware, software combinations reduce development time from months to weeks.

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By: DAVID SAVASTANO

Contributing Editor, Coatings World and Ink World, Coatings World and Ink World Magazine

Enabling embedded developers to create new designs for the Internet of Things (IoT), Texas Instruments (TI) launched three low-cost evaluation kits based on its embedded processors supporting Microsoft Azure Certified for Internet of Things. As one of the first semiconductor vendors with certified wireless microcontroller (MCU) and processor-based evaluation kits ready to work with the Microsoft Azure IoT Suite, TI is positioned to help developers begin IoT application development within minutes.
 
The Microsoft Azure IoT Suite’s agent code has been pre-ported to TI’s low-power SimpleLink Wi-Fi CC3200 wireless MCU LaunchPad kit and Sitara AM335x processor-based BeagleBone Black and BeagleBoard Green kits. Developers can expect additional certifications of TI products in the coming months.
 
“Building on today’s certifications, we are committed to working closely with Texas Instruments on industrial, automotive and consumer applications certified for Microsoft Azure IoT Suite,” said Barb Edson, General Manager for Data Platform and Internet of Things, Microsoft.
 
Semiconductor innovations are at the foundation of the IoT, connecting people, things and cloud. TI innovations are enabling the IoT by expanding from wired connections to wireless connectivity, driving down power to enable battery-operated connected products and increasing integration to drive down system cost.

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